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May 20, 2025Broadcom CPO: From concept to core competency
The future of AI infrastructure is being shaped by silicon and light, and today Broadcom moves that future forward. Co-packaged optics (CPO) — at this intersection — is the path forward for high-bandwidth communication in AI data centers.
Our CPO journey is well documented, as illustrated in Figure 1, from our investment announcement a little over four years ago, through two generations of product development and customer shipments. Last week, we announced our Gen 3 CPO with 200G/lane capability. But the foundation upon which we make this announcement is the maturation of our CPO manufacturing platform and Gen 2 CPO production release. What we announced as a concept in January 2021 is rapidly becoming a capability which will deliver immense value to our customers as they enter the next age of AI infrastructure architecture.
In October 2024, we publicly shared data for all 512 lanes of a TH5-Bailly system for the first time. It was a demonstration to the industry that high density integration of silicon photonics with high speed silicon can both yield and deliver a meaningful value proposition: more than 3.5X power savings.
Customers immediately wanted to understand our progress assessing system reliability. Figure 2 shows two systems we constructed to run various reliability cells. Figure 2a allows for reliability testing at the rack level. Complete systems are assembled and installed in a rack, and monitored for change in traffic performance while operating above maximum specified ambient temperature. Figure 2b allows for CPO chip level reliability testing at even further elevated temperatures than rack units, increasing the acceleration factor of the test.
We have completed Temperature Cycle and Mechanical Shock and Vibe reliability tests with data shared in Figures 3 and 4. All collected data is within instrument GR&R and further evidence that CPO, designed correctly for manufacturing, is robust and can be deployed at scale.
We have reused most critical platform elements in our migration from 200G/lane. We have maintained edge coupling, detachable connectors and ported our assembly and test platforms for both optical engines and full CPO assemblies from Gen 2 to Gen 3. While every new generation requires device innovation, platform consistency delivers meaningful improvements in time-to-market generation over generation.
As we look back on our journey to scale CPO, it’s clear that multigenerational progress depends on a strong ecosystem of partners and relentless execution. Optical interconnects must evolve even faster than the networks they support, and we’re meeting that challenge head-on. With the release of our Gen 3 200G/lane CPO and the rapid development of Gen 4 400G/lane CPO, Broadcom is ensuring that breakthrough network architectures are driven forward — not held back — by the interconnect.
As Technovera Co., we officially partner with well-known vendors in the IT industry to provide solutions tailored to our customers’ needs. Technovera makes the purchase and guarantee of all these vendors, as well as the installation and configuration of the specified hardware and software.
